金莎9001zz以诚为本(股份)有限公司

    Ticker : 300236.SZ
    CN
    High Selectivity SiN
    Product Applications
    • ? 3D NAND Flash Silicon Nitride Etching Process
    • ? 12-inch Process
    • ? Supporting Equipment: TEL and DNS
    Product Characteristics
    • ? Exhibits outstanding etching selectivity with a selectivity ratio exceeding 2000:1, enabling high-precision etching between different materials, effectively avoiding damage to non-target areas and ensuring precise control.
    • ? Demonstrates excellent protection performance for Poly and OX, preventing surface damage.
    • ? Features an extremely low level of metal ion contamination, significantly reducing the risk of impurity introduction during etching and meeting the stringent requirements of advanced semiconductor manufacturing.
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